sanken electric co., ltd. http://www.sanken-ele.co.jp/en/ LC5511D description the lc5500 series is the power ic for the led driver which has an incorporated power mosfet, designed for input capacitorless applications, and making it possible for systems to comply with the harmonics standard (iec61000- 3-2 class c). the controller adapts the average current control method for realizing high power factors, and the quasi-resonant topology contributes to high efficiency and low emi noise. the rich set of protection features helps to realize low com- ponent counts, and high performance-to-cost power supply. the LC5511D is intended for non-isolated designs. the incorporated mosfet has a v dss (min) rating of 650 v and r ds(on) (max) of 3.95 . it is capable of a maximum output power of 13 w on 230 vac supply and 10 w on universal input supply (85 to 265vac) based on the thermal rating. note that the maximum output power can be up to 120% to 140% of this value. however, it may be limited in applica- tions with low output voltage or short duty cycle. features and benefits ? integrated on-time control circuit (it realizes high power factor by average current control) ? integrated startup circuit (no external startup circuit necessary) ? integrated soft-start circuit (reduces power stress during start-up on the incorporated power mosfet and output rectifier) ? integrated bias assist circuit (improves startup performance, suppresses vcc voltage droop during operation, and allows use of low-rated ceramic capacitor on vcc pin) ? integrated leading edge blanking (leb) circuit ? integrated maximum on-time limit circuit ? protection features: ? overcurrent protection (ocp): pulse-by-pulse ? overvoltage protection (ovp): pins vcc, isense, and ocp, auto restart ? overload protection (olp): auto restart ? thermal shutdown (tsd): latched shutdown single-stage power factor corrected off-line switching regulator ic typical application package: 8-pin dip not to scale 5 1 2 3 d/st 8 s/gnd vcc control part c2 c5 d8 u1 d1 d3 d2 d4 f1 l1 c1 d5 c4 dz1 comp dz2 d6 t1 c3 d7 l2 led ocp isense nc r1 c6 d9 s/gnd r ocp r3 r4 r5 r 6 r7 vac c8 c7 c9 c11 c12 LC5511D 4 6 c10 r8 november 26, 2012 applications ? led lighting fixtures ? led light bulbs LC5511D-ds
2 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 selection guide part number package LC5511D dip8 with pin 7 removed absolute maximum ratings t a = 25c, unless otherwise specified characteristic symbol notes pins rating unit drain current 1 i dpeak single pulse 8 ? 1 2.5 a single pulse avalanche energy 2 e as i lpeak = 2.0 a, v dd = 99 v, l = 20 mh 8 ? 1 47 mj control part input voltage v cc 2 ? 1 35 v ocp pin voltage v ocp 3 ? 1 ? 2.0 to 5.0 v comp pin voltage v comp 4 ? 1 ? 0.3 to 7.0 v isense pin voltage v sen 6 ? 1 ? 0.3 to 5.0 v allowable power dissipation of mosfet 3 p d1 mounted on a 15 mm 15 mm pcb 8 ? 1 0.97 w operating ambient temperature t op D? 55 to 125 c storage temperature t stg D? 55 to 125 c channel temperature t ch D 150 c 1 refer to mosfet safe operating area curve. 2 refer to mosfet avalanche energy derating coefficient curve. 3 refer to mosfet temperature versus power dissipation curve. the polarity value for current specifies a sink as "+," and a source as ? ? ,? referencing the ic.
3 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 electrical characteristics of control part t a = 25c, v cc = 20 v, unless otherwise specified characteristic symbol test conditions pins min. typ. max. unit startup operation operation start voltage v cc(on) 2 ? 1 13.8 15.1 17.3 v operation stop voltage* v cc(off) 2 ? 1 8.4 9.4 10.7 v operating current i cc(on) 2 ? 1 ? ? 3.7 ma startup circuit operation voltage v startup 8 ? 1 42 57 72 v startup current i cc(startup) v cc = 13 v 2 ? 1 ? 5.5 ? 3.0 ? 1.0 ma startup current threshold biasing voltage-1* v cc(bias)1 2 ? 1 9.5 11.0 12.5 v startup current threshold biasing voltage-2 v cc(bias)2 2 ? 1 14.4 16.6 18.8 v normal operation pwm operation frequency f osc 8 ? 1 11.0 14.0 18.0 khz maximum on-time t on(max) 8 ? 1 30.0 40.0 50.0 s comp pin control voltage lower limit v comp(min) 4 ? 1 0.55 0.90 1.25 v error amplifier reference voltage v sen(th) 6 ? 1 0.27 0.30 0.33 v error amplifier source current i sen(source) 4 ? 1 ? 11 ? 7 ? 3 a error amplifier sink current i sen(sink) 4 ? 1 3 7 11 a leading edge blanking time t on(leb) 3 ? 1 ? 500 ? ns quasi-resonant operation threshold voltage-1 v bd(th1) 3 ? 1 0.14 0.24 0.34 v quasi-resonant operation threshold voltage-2 v bd(th2) 3 ? 1 0.12 0.17 0.22 v protection operation ocp pin overcurrent protection (ocp) threshold voltage v ocp 3 ? 1 ? 0.66 ? 0.60 ? 0.54 v ocp pin source current i ocp 3 ? 1 ? 120 ? 40 ? 10 a ocp pin overvoltage protection (ovp) threshold voltage v bd(ovp) 3 ? 1 2.2 2.6 3.0 v overload protection (olp) threshold voltage-1 v comp(olp)1 4 ? 1 5.0 5.5 6.0 v overload protection (olp) threshold voltage-2 v comp(olp)2 4 ? 1 4.1 4.5 4.9 v isense pin ovp threshold voltage v sen(ovp) 6 ? 1 1.6 2.0 2.4 v vcc pin ovp threshold voltage v cc(ovp) 2 ? 1 28.5 31.5 34.0 v thermal shutdown activating temperature t j(tsd) ? 135 ? ? c *v cc(bias)1 > v cc(off) always.
4 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 electrical characteristics of mosfet t a = 25c, unless otherwise specified characteristic symbol test conditions pins min. typ. max. unit drain-to-source breakdown voltage v dss 8 ? 1 650 DD v drain leakage current i dss 8 ? 1 DD 300 a on resistance r ds(on) 8 ? 1 DD 3.95 switching time t f 8 ? 1 DD 250 ns thermal resistance r ch-c between channel and case; case temperature,t c , measured at the center of the case top surface DDD 42 c/w
5 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 10 1 0.1 0.01 transient thermal resistance, r ch-c (c/w) transient thermal resistance curve time (s) 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 ambient temperature, t a (c) 1.2 1.0 0.8 0.6 0.4 0.2 0 0 255075 125 100 150 mosfet temperature versus power dissipation curve allowable power dissipation, p d1 (w) channel temperature, t ch (c) 100 80 60 40 20 0 25 50 75 125 100 150 eas temperature derating coefficient (%) mosfet avalanche energy derating coefficient curve drain-to-source voltage, v ds (v) 10 1 0.1 0.01 1 10 100 1000 drain current, i d (a) mosfet safe operating area curve drain current limited by on-resistance 1 ms 0.1 ms to use this graph, apply the s.o.a temperature derating coefficient taken from the graph at the left t a = 25c, single pulse channel temperature, t ch (c) 100 80 60 40 20 0 0 25 50 75 125 100 150 safe operating area temperature derating coefficient (%) s. o. a. temperature derating coefficient curve characteristic performance
6 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 functional block diagram functional block diagram functional block diagram pin-out diagram 1 2 3 4 8 6 5 d/st isense nf s/gnd vcc ocp comp s/gnd tsd leb d/st start up reg bias uvlo vcc ocp ovp osc ocp detection bottom reg control feedback olp drv comp isense q s r ota nf control part LC5511D pin list table number name function 1 s/gnd mosfet source and gnd pin for the control part 2 vcc supply voltage input and overvoltage protection (ovp) signal input 3 ocp overcurrent protection, quasi-resonant signal input pin, and overvoltage protection (ovp) signal input 4 comp feedback phase-compensation input 5nf no function; must be externally connected to s/gnd pin with as short a trace as possible, for stable operation of the ic 6 isense output current detecting voltage input and overvoltage protection (ovp) signal input 7 ? pin removed 8 d/st mosfet drain pin and input of the startup current
7 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 package outline drawing, dip8 pb-free. device composition compliant with the rohs directive. 0 . 2 5 + 0 . 1 - 0 . 0 5 6.5 1 4 5 8 9.4 0.3 0.5 0.1 0.89 typ 4.2 0.3 3.3 3.4 0.1 0.2 (7.6 typ) 2.54 typ -0.05 -0.05 0.2 0.5 7.5 +0.3 +0.3 1.0 1.52 a lc b c a: part #: 5511 b: lot number 3 digits, plus d 1 st letter: last digit of year 2 nd letter: month jan to september: numeric october: o november: n december: d 3 rd letter: week date 1 to 10: 1 date 11 to 20: 2 date 21 to 31: 3 c: sanken control number unit mm
8 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5c to 35c) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunlight. ? reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using silicone grease with a heatsink ? when silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials inc. sc102 dow corning toray co., ltd. soldering ? when soldering the products, please be sure to minimize the working time, within the following limits: 2605c 101 s (flow, 2 times) 38010c 3.50.5 s (soldering iron, 1 time) ? soldering should be at a distance of at least 1.5 mm from the body of the products. electrostatic discharge ? when handling the products, the operator must be grounded. grounded wrist straps worn should have at least 1 m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment should be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil.
9 sanken electric co., ltd. LC5511D-ds single-stage power factor corrected off-line switching regulator ic LC5511D november 26, 2012 ? the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property r ights or any other rights of sanken or any third party which may result from its use. ? although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of se micon- ductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventativ e measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equ ip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is requi red (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. ? in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by dera ting the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stres ses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stress es, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ic's including power devices have large self-heating value, the de gree of derating of junction temperature affects the reliability significantly. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, ch emically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sanken's dis tribu- tion network. ? the contents in this document must not be transcribed or copied without sanken's written consent.
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